Expose pad design

Hello Tevhide,

Thanks for reaching out to us. Consulting page 15 of the onsemi NCV8518C Datasheet, we confirmed that the package's physical exposed thermal pad is indeed intentionally larger than the recommended PCB land footprint defined by the manufacturer.

This structural geometric offset is a standard layout guideline common to many onsemi exposed pad components to optimize manufacturing yield and prevent component shifting during reflow.

If you want a custom 3D model where the exposed pad falls within the PCB land, or if you need anything else, please let us know. We're here to help!