The SnapMagic footprint for this part doesn't appear to match the recommended footprint from the Murata datasheet. The recommendation shows for separate GND pads with an open area in the middle, while the SM footprint shows an I-shaped GND pad.
Which is correct?
Added 1 day, 6 hours ago.
In addition, the datasheet shows "non-resist areas," which points to solder mask openings between some of the pads, likely for RF reasons.
Answered 1 day, 5 hours ago.
Hello kslamba3,
Thank you for reaching out and sharing your feedback.
We’ll review this part and get back to you as soon as possible.
Best Regards
Amina
Answered 1 day, 2 hours ago.
Hello kslamba3
Thank you for your detailed feedback and for your patience while we reviewed the footprint.
We checked it against Murata’s recommended land pattern and confirmed the following:
GND pad: The I shaped GND copper is correct. The four ground lands are connected by a central electrode, which the datasheet specifies should be covered by solder resist, leaving only the four lands exposed for soldering.
Non resist, non metal area: This was missing from the original footprint. We’ve now defined it on the tStop and tRestrict layers to prevent solder mask coverage and copper pours in this region, as required for RF performance and maintaining the intended 50 Ω impedance matching.
The updated footprint is now available on our site. Please feel free to download it and let us know if the changes meet your expectations.
https://www.snapeda.com/parts/MM8930-2620RJ4/Murata/view-part/
We really appreciate your feedback. Please do not hesitate to reach out anytime for any concerns or feedback. We are always happy to help.
Best Regards
Amina
Answered 21 hours, 10 minutes ago.